Taiwanese chipmaker MediaTek today announced the Dimensity 720—the company's newest 5G-ready chipset for mid-tier smartphones.
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| MediaTek Dimensity 720 |
The 5G chip for the masses?
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| Dimensity 720 specs |
The MediaTek Dimensity 720 is a TSMC-built 7nm chip that aims to deliver feature-packed 5G experiences to mass-market consumers.
It is built using 2x ARM Cortex-A76 big cores and 6x Cortex-A55 cores. Both are clocked at 2.0GHz.
It is paired with the ARM Mali-G57 MC3 GPU, MediaTek APU for AI tasks, LPDDR4X up to 2133MHz support, UFS 2.2-class storage support, and up to 64MP or 20 + 16MP camera support with up to 4K 30fps video recording.
The display also supports up to FHD+ 2560 x 1080 resolution 20:9 screens with up to 90Hz screen refresh rate and real-time HDR10+ with MiraVision tech.
The SoC solution boasts a 2CC CA carrier aggregation, Voice over New Radio (VoNR), 5G and 4G dual SIM with dual standby. The 5G tech of this device supports both standalone (SA) and non-standalone (NSA) sub-6GHz networks in Asia, North Ameria, and Europe.
For WiFi, it has up to 2x2 WiFi 5 (802.11 a/b/g/n/ac). For Bluetooth, it uses the new Bluetooth 5.1 tech.
It also supports the Integrated Voice Wakeup (VoW) to minimize the power consumption of always-on voice assistants and dual-mic noise suppression to let voice assistants hear users clearer even in noisy environments.
from GIZGUIDE | Your Gadget Coach https://ift.tt/32NqLjs


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